Rapid single flux quantum very large scale integration

Gross, Peter Alan (2002-12)

Thesis (MScEng)--University of Stellenbosch, 2002.

Thesis

ENGLISH ABSTRACT: Very Large Scale Integration (VLSI) of the Rapid Single Flux Quantum (RSFQ) superconducting logic family is researched. Insight into the design methodologies used for large-scale digital systems and related logistics are reviewed. A brief overview of basic RSFQ logic gates with in mind their application in a cell based layout scheme suited for RSFQ is given. A standard cell model is then proposed, incorporating these cells, on which, a library of low temperature superconducting (L TS) cells are laid out. Research is made into computer techniques for storing and manipulating large-scale circuit netlists. On this base, a method of technology mapping Boolean circuits to an RSFQ equivalent is achieved. Placements on-chip are made, optimized for minimum net length, routed and exported to a popular electronic mask format. Finally, the convergent technology fields of solid state cooling and high-temperature superconducting electronics (HTS) are investigated. This leads to a proposal for a low profile, low cost, HTS cryopackaging concept.

AFRIKAANSE OPSOMMING: Grootskaalse integrasie (VLSI) van die "Rapid Single Flux Quantum" (RSFQ) supergeleidende familie van logiese hekke word uiteengesit. Insig in die ontwerpmetodes vir grootskaaIse digitale stelsels en verwante aspekte word ondersoek. 'n Kort oorsig van basiese RSFQ logiese hekke word gegee, met hulle toepassing in 'n uitlegskema wat geskik is vir RSFQ. 'n Standaard sel model, wat bogenoemde selle insluit, word voorgestel en 'n selbiblioteek word uitgele vir lae temperatuur supergeleidende bane. Ondersoek word ingestel na die manipulasie van die beskrywing van elektroniese bane en 'n manier om logiese Boolese baanbeskrywings om te skakel na fisiese RSFQ bane. Die fisiese plasing van selle word bespreek ten einde die verbindingslengte tussen selle te minimeer. Die finale uitleg word omgeskakel na 'n staandaard elektroniese formaat vir baanuitlegte. Die konvergerende tegnologievelde van "soliede toestand" verkoeling en hoe-temperatuur supergeleidende elektroniese bane word bespreek. Ten slotte word 'n nuwe tipe, lae profiel en lae koste kriogeniese verpakking voorgestel.

Please refer to this item in SUNScholar by using the following persistent URL: http://hdl.handle.net/10019.1/49734
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