16th INTERNATIONAL CONFERENCE ON HEAT TRANSFER, FLUID MECHANICS AND THERMODYNAMICS: 3D PRINTED MINIATURE COOLER FOR ELECTRONICS THERMAL MANAGEMENT ONLINE, 8 – 10 AUGUST 2022

Imtiaz, Nida ; Wahid, Mazlan Abdul ; Kamaruzaman, Natrah Binti ; Ng, Kim Choon ; Xu, Ben Bin ; Shahzad, Muhammad Wakil (2022-08-08)

Imtiaz, N., Wahid, M., A., Kamaruzaman, N., B., Ng, K., C., Xu, B., B., Shahzad, M., W., 16th INTERNATIONAL CONFERENCE ON HEAT TRANSFER, FLUID MECHANICS AND THERMODYNAMICS: 3D PRINTED MINIATURE COOLER FOR ELECTRONICS THERMAL MANAGEMENT ONLINE, 8 – 10 AUGUST 2022

The original publication is available at: hefat2022.org

Proceedings International

The global Central Processing Units (CPUs) are expected to grow at a significant CAGR of 3.6% by 2028. The major factors driving the growth are increasing demand for high processing power CPUs in various applications such as personal computers, servers, and portable computers, among others; growing adoption of enterprise systems that require high-performance CPUs with faster processing speed; and rise in the number of CPU cores per chip over time. However, thermal management is a crucial issue to maintain their performance with increasing processing speed and number of CPU cores per chip. The conventional fans/blowers are unable to maintain required temperature and hence deteriorate CPU performance. We proposed an innovative miniature indirect evaporator cooler for thermal management and local cooling of electronic boards, CPU and Graphics Processing Unit (GPU). In proposed unit, the humidity of supply air is maintained by separating dry and wet channels via thin copper film that also provide good heat transfer properties. Thin water layer is maintained through wick surface in wet channel to extract heat from supply air flowing in dry channel. In order to achieve the objectives and evaluate the performance, miniature indirect evaporator cooler is designed and most of parts are fabricated using 3D printing facility. Extensive experiments are conducted at assorted temperature to map the performance for various electronic units applications. The result shows that the 200mm x 150mm cell with 5 dry and wet channels can achieve up to 40–45Watt cooling capacity. Based on 3D printed modular design, it has flexibility to improve capacity to match application requirements. The proposed miniature cooler can be employed for electronic thermal management and maintain low temperature to enhance their efficiency and improve processing speed.

Please refer to this item in SUNScholar by using the following persistent URL: http://hdl.handle.net/10019.1/125792
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