16th INTERNATIONAL CONFERENCE ON HEAT TRANSFER, FLUID MECHANICS AND THERMODYNAMICS: 3D PRINTED MINIATURE COOLER FOR ELECTRONICS THERMAL MANAGEMENT ONLINE, 8 – 10 AUGUST 2022
Date
2022-08-08
Journal Title
Journal ISSN
Volume Title
Publisher
ASTFE
Abstract
The global Central Processing Units (CPUs) are expected to
grow at a significant CAGR of 3.6% by 2028. The major
factors driving the growth are increasing demand for high
processing power CPUs in various applications such as
personal computers, servers, and portable computers, among
others; growing adoption of enterprise systems that require
high-performance CPUs with faster processing speed; and rise
in the number of CPU cores per chip over time. However,
thermal management is a crucial issue to maintain their
performance with increasing processing speed and number of
CPU cores per chip. The conventional fans/blowers are unable
to maintain required temperature and hence deteriorate CPU
performance.
We proposed an innovative miniature indirect evaporator
cooler for thermal management and local cooling of electronic
boards, CPU and Graphics Processing Unit (GPU). In proposed
unit, the humidity of supply air is maintained by separating dry
and wet channels via thin copper film that also provide good
heat transfer properties. Thin water layer is maintained through
wick surface in wet channel to extract heat from supply air
flowing in dry channel. In order to achieve the objectives and
evaluate the performance, miniature indirect evaporator cooler
is designed and most of parts are fabricated using 3D printing
facility. Extensive experiments are conducted at assorted
temperature to map the performance for various electronic units
applications. The result shows that the 200mm x 150mm cell
with 5 dry and wet channels can achieve up to 40–45Watt
cooling capacity. Based on 3D printed modular design, it has
flexibility to improve capacity to match application
requirements. The proposed miniature cooler can be employed
for electronic thermal management and maintain low
temperature to enhance their efficiency and improve processing
speed.
Description
Imtiaz, N., Wahid, M., A., Kamaruzaman, N., B., Ng, K., C., Xu, B., B., Shahzad, M., W., 16th INTERNATIONAL CONFERENCE ON HEAT TRANSFER, FLUID MECHANICS AND THERMODYNAMICS: 3D PRINTED MINIATURE COOLER FOR ELECTRONICS THERMAL MANAGEMENT ONLINE, 8 – 10
AUGUST 2022
The original publication is available at: hefat2022.org
The original publication is available at: hefat2022.org
Keywords
Heat transfer, Fluid mechanics, Thermodynamics